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Silicon

All of Axzon’s sensor solutions are powered by our innovative, ultra-low power integrated circuits (ICs), Magnus® and Opus™. Our ultra low power technology combined with our signature innovation of the Chameleon™ technology (self-tuning front-end), and power harvesting capability allow our sensors to be placed on a variety of surfaces, without adverse impact to the chip’s sensitivity.

Our silicon family is split into two, Magnus® IC family and Opus™ IC family.

Opus IC

Opus IC

Opus IC powers Nurovault™ , the world’s first wireless Peel & Stick™ temperature and environment logger, marking a new era of accountability and traceability in cold chain logistics

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AZN305-D Magnus®-S3 M3D Passive Sensor IC

The AZN305-D Magnus®-S3 M3D Passive Sensor IC extends the Magnus® line of Smart Passive Sensing™ ICs (Integrated Circuits). The Magnus-S3 M3D IC incorporates three sensors:

1. The Chameleon engine generates a SENSOR CODE that quantifies the adaptive RF impedance setting used to match the sensor antenna. This is particularly useful for monitoring moisture levels.

2. An on-chip Received Signal Strength Indicator RSSI monitor indicates the amount of RF power reaching the chip. It also allows the wireless reader to manage its output power for optimum sensor performance.

3. The on-chip temperature sensor generates a TEMPERATURE CODE data value proportional to the temperature.

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AZN305-E Magnus®-S3 M3E Passive Sensor IC

The Magnus®-S3 M3E Sensor IC (Integrated Circuit) employs Smart Passive Sensing™ technology to enable a new class of maintenance-free and battery-free sensors. The Magnus-S3 M3E IC incorporates two sensors:

1. An on-chip Received Signal Strength Indicator RSSI monitor indicates the amount of RF power reaching the chip.

2. The on-chip temperature sensor generates a TEMPERATURE CODE data value proportional to the temperature. The IC can be calibrated to provide precise temperature measurements.

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Ready to start with item-level cold chain visibility?

Request Peel & Stick™ Logger to evaluate Axzon in your own operation, or explore the Peel & Stick™ Logger page to understand specifications, deployment model, and use cases.

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